The 3D & Systems Summit will address the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing.
The summit will focus on high reliability and high performance of disruptive applications like Mobile and IoT. Invited distinguished global industry speakers, an exhibition area, B2B matchmaking, unique networking and business opportunities await all participants and exhibitors.
Our experts are more than happy to answer any questions and discuss how we can help you to innovate. Do not hesitate to contact us today.
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