The NEO 2000 product line is an advanced plasma ashing/etch system from Trymax Semiconductor Equipment with the latest photoresist removal technology offering exceptional performance at a very competitive price. The NEO 2000 is specifically designed for applications on 100mm to 200mm diameter substrates.
It’s equipped with an ultra-fast transfer platform and is flexible and configurable for handling different dimensions of substrates at the same time with no hardware changes. The NEO 2000 series has a compact modular design and can deliver a high throughput to achieve the lowest Cost of Ownership.
100/150/200mm substrate size configurable
2 or 3 cassette stations or 2 integrated SMIF’s
5 axis dual arm robot handling with specific substrate grippers
4 different process chamber technologies available:
Microwave downstream (2.45 GHz)
RF bias (13.56 MHz)
Dual Source (Microwave, RF bias)
CCP Top RF powered (13.56Mhz)
Mechanical throughput >175wph
Compact footprint
Very low Cost of Ownership
Fully digital controlled, devicenet-ethernet
Windows based industrial computers
Front and rear user interfaces
Bulk resist, post LDI resist strip
Descum processing
Polymer removal
Post high dose implant strip
Silicon nitride/silicon carbide etch applications
TaSi etch
MEMS applications
Advanced packaging processing (PR, PI, BCB, PBO)
RF filter BAW/SAW resist processing
SEMI S2-01
SEMI S8-01
CE EU-RoHs
UL (optional)
Taiko wafers handling
Aligner (combined wafer ID reading)
AGV
If you have any questions please do not hesitate to email or call us +31 (0)24 350 08 09
