The NEO 3400 series production platform is one of the latest additions to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment.
It’s ready for the highest volume of production and adaptable to every production ramp and budget. The NEO 3400 platform can be configured with any of the available Trymax NEO process modules and is compatible with substrates up to 300mm in diameter. The small footprint and modular design can be flexibly configured based on your production needs.
This platform can be used as a full bridge tool with compatibility to run both 200 and 300mm diameter substrates.
200/300mm substrate size
4 FOUP loaders
4 axis dual arm robot handling with x-track
2 or 4 process chambers
4 different process chamber technologies available:
Microwave downstream (2.45 GHz)
RF bias (13.56 MHz)
Dual Source (Microwave, RF bias)
DCP (direct capacitive coupled (2x RF) plasma)
Mechanical throughput >300wph
Compact footprint
Very low Cost of Ownership
Fully digital controlled, devicenet-ethernet
Windows based industrial computers
OHT or AGV
Bulk resist, post LDI resist strip
Descum processing
Polymer removal
Post high dose implant strip
Silicon nitride/silicon carbide etch applications
TaSi etch
MEMS applications
Advanced packaging processing (PR, PI, BCB, PBO)
RF filter BAW/SAW resist processing
SEMI S2-01
SEMI S8-01
CE EU-RoHs
UL (optional)
Wafer aligner (combined with OCR reader)
Cooling station
If you have any questions please do not hesitate to email or call us +31 (0)24 350 08 09
