The NEO 200A product is the smallest footprint single chamber platform for advanced ashing and etching products from Trymax Semiconductor Equipment.
It’s a fully automated single chamber system that can be configured with any of the currently available Trymax NEO process modules. It’s compatible with substrates up to 200mm in diameter. The small footprint of the NEO 200A is configured with a dual cassette.
100 / 150 /200mm substrate size
Dual cassette platform
4 axis dual arm robot handling
4 different process chamber technologies available:
Microwave downstream (2.45 GHz)
RF bias (13.56 MHz)
Dual Source (Microwave, RF bias)
CCP Top RF powered (13.56Mhz)
Mechanical throughput >100wph
Compact footprint
Very low Cost of Ownership
Fully digital controlled, devicenet-ethernet
Windows based industrial computers
Single slot cooling station
Front and rear user interfaces
Bulk resist, post LDI resist strip
Descum processing
Polymer removal
Post high dose implant strip
Silicon nitride/silicon carbide etch applications
TaSi etch
MEMS applications
Advanced packaging processing (PR, PI, BCB, PBO)
RF filter BAW/SAW resist processing
CE EU-RoHs
UL (optional)
Fab host control SECS-II
If you have any questions please do not hesitate to email or call us +31 (0)24 350 08 09
