Trymax NEO 2000UV

The NEO 2000UV is an advanced UV Curing/Erase system from Trymax Semiconductor Equipment with the latest and fastest UV curing and charge erase technology on the market. It offers exceptional performances meeting nowadays semiconductor fab requirements. It is a high throughput system with optimized Cost of Ownership. The NEO 2000UV is specifically designed for applications up to 200mm diameter substrates.

All specifications & features

Features

Trymax platform with latest digital technology, EtherCAT®

Dual process chamber

Variable irradiance control

2 open cassette stations with cassette size detection system or 2 integrated SMIF

4 axis robot

Front and rear user interfaces

Ionizer bar

Fab host control SECS-II

Applications

Photo-stabilization prior to ion implant

Photo-stabilization prior to etch (Poly-Si, Oxide, Metal)

Selectivity improvement

Use and curing of DUV resist used for smaller CD

Interlayer insulating film formation for thin-film magnetic heads

Multitude of semiconductor applications such as compound semiconductor lift-off processing

Compliance

SEMI S2-01

SEMI S8-01

CE EU-RoHs

UL (optional)

Options

Wafer aligner

Wafer mapping

Cooling station

Bar code reader

AGV and OHT

Wafer aligner (combined with OCR reader)

Questions about this product?

If you have any questions please do not hesitate to email or call us +31 (0)24 350 08 09