The NEO 2400 series production platform is one of the latest additions to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment.
The NEO 2400 platform can be configured with any of the available Trymax NEO process modules and is compatible with the substrates up to 200mm in diameter.
This platform can be used as a full bridge tool with the compatibility to run substrates of different type and diameter up to 200mm.
100/200mm substrate size configurable
4 integrated SMIF indexer or 4 open cassette stations
4 axis dual arm robot handling with x-track (optional)
2 or 4 process chambers
4 different process chamber technologies available:
Microwave downstream (2.45 GHz)
RF bias (13.56 MHz)
Dual Source (Microwave, RF bias)
CCP Top RF powered (13.56Mhz)
Mechanical throughput >300wph
Compact footprint
Very low Cost of Ownership
Fully digital controlled, devicenet-ethernet
Windows based industrial computers
Cooling station and wafer aligner (combined with OCR reader)
Bulk resist, post LDI resist strip
Descum processing
Polymer removal
Post high dose implant strip
Silicon nitride/silicon carbide etch applications
TaSi etch
MEMS applications
Advanced packaging processing (PR, PI, BCB, PBO)
RF filter BAW/SAW resist processing
SEMI S2-01
SEMI S8-01
CE EU-RoHs
UL (optional)
AGV and OHT
Taiko wafers handling
If you have any questions please do not hesitate to email or call us +31 (0)24 350 08 09
